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Please use this identifier to cite or link to this item: http://ir.juit.ac.in:8080/jspui/jspui/handle/123456789/5543
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dc.contributor.authorCoombs, Clyde F.-
dc.date.accessioned2022-08-04T04:39:27Z-
dc.date.available2022-08-04T04:39:27Z-
dc.date.issued2001-
dc.identifier.urihttp://ir.juit.ac.in:8080/jspui//xmlui/handle/123456789/5543-
dc.language.isoenen_US
dc.subjectPrinted Circuiten_US
dc.subjectInterconnectivity Revolutionen_US
dc.subjectSemiconductor Packagingen_US
dc.subjectResinen_US
dc.titlePrinted Circuits Handbook; 6th Ed.en_US
dc.typeeBooken_US
Appears in Collections:Electronics & Communication Engineering

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Printed Circuits Handbook, 6th Ed. by Clyde F Coombs (2008).pdf32.65 MBAdobe PDFView/Open
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